Thermaltake TG-50 Premium Thermal Compound

The Thermaltake CL-O024-GROSGM-A is a premium thermal compound, sold as the TG-50, that helps PC builders improve heat transfer between a processor and its cooler. With an 8.0 W/m-k thermal conductivity enhanced by diamond powder, it removes heat from the CPU die quickly, which can lower operating temperatures, quiet fans, and open extra headroom for overclockers and power users.

Everything needed for a clean application comes in the box. A reusable honeycomb stencil positions over the integrated heat spreader so you can place the right amount of paste in seconds, and the included spreader lets you create an even layer that maximises surface contact. This makes the TG-50 ideal for first-time builders who want guidance, as well as experienced technicians who value speed and consistency when working through multiple systems.

Thermaltake formulates the compound for long service life. With a density of 2.9 g/cm³ and a viscosity of 47 Pa-s, it stays where you place it and resists pump-out during temperature swings. The material does not conduct electricity, so accidental spills around capacitors or motherboard traces will not cause short circuits. It also resists drying and cracking, helping the paste maintain its 0.035 °C-in²/W thermal impedance over years of continuous operation.

Whether you are assembling a gaming tower, refreshing the thermal interface on a workstation, or simply lowering idle temperatures on a family desktop, the TG-50 kit provides a reliable, easy-to-use solution that keeps critical components running at their best.

• Thermal conductivity: 8.0 W/m-k with diamond powder enhancement
• Application that is accurate and mess free thanks to the honeycomb stencil and spreader
• Formula that is non-electrically conductive for added safety
• Resists dry-out and cracking for long-term stability
• Density: 2.9 g/cm³; viscosity: 47 Pa-s; thermal impedance: 0.035 °C-in²/W
• Color: Gray