Alpha Nanotech Silica Wafers (Dry Oxide Only; Sizes: 6'', 4'', 2'', Oxide Thickness: 200 nm) (2 inches, Qty: 1 pc)

Prime/CZ Virgin Grade Silica Substrates Prime/CZ Virgin Grade; Orientation: <100>; Resistivity: 1-50 Ω; Type: P/Dopant: Boron; TIR <3 μm, TTV <10 μm, BOW <10 μm, Roughness <0.5 nm; Available in two formats: 5mm x 5mm diced chips in gel membrane box (25 single-sided polished chips per box) or Single-Side Polished WafersSizes of the Wafers Available: Six Inch 6'' Wafer with a Thickness of 650 µm +/- 20 µm; Four Inch 4'' Wafer with a Thickness of 525 µm +/- 20 µm; Three Inch 3'' Wafer with a Thickness of 400 µm +/- 20 µm;Two Inch 2'' Wafer with a Thickness of 300 µm +/- 15 µm;Gel membrane boxes or wafer carriers are included for every single purchase. For more information, please visit us at https://www.alphananotechne.com/silicon-wafers or send us your questions to info@alphananotechne.com or ask questions directly on the "Have a question?" tab above.

• Grade: Prime / CZ Virgin;
• Orientation: <100>;
• Type/Dopant: P/Boron; Resistivity: 1-50 Ω;
• Front Surface: Polished with Thermal Oxide Layer of 200 nm; Back Surface: Etched;
• TIR < 3 μm; TTV < 10 μm; BOW < 10 μm; Roughness < 0.5 nm.